BGA晶片拆焊 成功案例 至今已逾 80,000pcs. 晶片拆焊更換成功實作案例。晶片種類有 :CPU、 PCH、 ACH、 eMMC、 dRAM、Lan…chipset BGA-Rework-22_pic-S-878XX bottomBGA-Rework-22_pic-pch_removeBGA-Rework-22_pic-pch_beforeBGA-Rework-22_pic-pch_afterBGA-Rework-22_pic-modify-IMG_3097BGA-Rework-22_pic-modify-IMG_1931BGA-Rework-22_pic-LGA36457-ABGA-Rework-22_pic-Label 526BGA-Rework-22_pic-Label 303BGA-Rework-22_pic-Label 299BGA-Rework-22_pic-IMG_3921BGA-Rework-22_pic-IMG_3279BGA-Rework-22_pic-IMG_2830BGA-Rework-22_pic-IMG_2803BGA-Rework-22_pic-IMG_2774BGA-Rework-22_pic-IMG_2773BGA-Rework-22_pic-IMG_2394BGA-Rework-22_pic-cpu-modify Previous Next